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Tyndall National Institute

Tyndall is a leading European research centre in integrated ICT hardware and systems and a research flagship of University College Cork. Researchers at Tyndall work with industry and academia to transform research into products in core market areas of communications, agri-tech, energy, environment and health.
As the national institute for micro/nanoelectronics and photonics, Tyndall employs over 450 researchers, engineers and support staff, with a cohort of 120 full-time graduate students. Researchers at Tyndall generate over 300 peer-reviewed publications annually.
Tyndall provides dedicated support to its research community through the following Offices: Office of the Chief Scientist, Finance, Human Resources and Graduate Studies and via UCC Innovation (Technology Transfer). These services provide information, assistance, guidance and advice on all aspects of the planning, execution, sustaining and application of research.
Researchers benefit from one-on-one proactive guidance and mentoring support regarding all elements of: (i) research policy (including campus companies, contract research, intellectual property, consultancy, conflict of interest, research conduct and financial procedures); (ii) funding opportunity identification and proposal preparation, and; (iii) post-award research contract administration.
UCC Innovation provides advice and practical assistance in the identification, capture, management, and appropriate exploitation of intellectual property. UCC has a GDPR unit as part of the Office of Corporate and Legal Affairs and Tyndall has its own Data Protection Officer. With a network of 200 industry partners and customers worldwide, Tyndall generates 85% of its €35M income each year from competitively won contracts.
Tyndall is home to a high-tech national research infrastructure unique in Ireland and is a national research asset. Hosting the only full CMOS, Micro-Electronic-Mechanical Systems (MEMS), III-V Compounds, and Flexible Wafer Semiconductor fabrication facilities and services in Ireland, Tyndall is capable of creating opportunities and prototyping new products for its target industries. In recent years Tyndall received international recognition for designing, miniaturising and prototyping products to drive connectivity.
Tyndall researchers have won numerous awards for their ground-breaking research on new materials, devices and systems across micro/nanoelectronics and photonics, including in the areas of ICT for Health, smart farming, wearables and the Internet of Things (IoT). Tyndall is also a lead partner in European research programmes in electronics and photonics and their integration into smart systems with applications in communications, agri-tech, energy, environment and health. In H2020, Tyndall has delivered value to European research in 97 projects so far (16 as coordinator).
UCC is an award-winning institution with a history of independent thinking stretching back over 170 years. UCC is proud to be ranked in the top 2% of universities in the world. Our beautiful university opened its gates to just 115 students in 1849 and now has a student population of over 21,000. UCC is proud to hold a HR Excellence in Research Award and an Athena SWAN Bronze Award. UCC has an established Equality, Diversity and Inclusion (EDI) Unit. Established in 2016, Empowering Women at Tyndall (EW@T) supports female staff and students to reach their full potential, through building their confidence and increasing their visibility.

Role in the project

Tyndall will contribution to the project based on its expertise and facilities in nanofabrication, and electrical and structural characterisation of hybrid organic and inorganic devices. Tyndall will lead task 1.4 in WP1 and participate in WP3, WP4 and WP5. In particular, Tyndall will contribute to the fabrication of top-gate test structures and transistor structures based on metal/molecular layer ‘channel’, and impedance spectroscopy of molecular layer/dielectric interface. Tyndall will also lead ‘Establishing links with bench marking and road mapping bodies (CMOS, beyond CMOS) and main magnetic networks’ in WP7.

Nanofabrication facilities (flexible fabrication facilities allowing developing process steps for novel material systems and custom-designed device architectures)

UV and DUV lithography; RAITH e-line and a new Elionix ELS-G100 electron beam lithography (EBL) tools; two new inductively coupled plasma (ICP) etching for fluorine- and chlorine-based chemistries with recipes for etching semiconductors, dielectrics, polymers, and selected metals; e-beam dielectric evaporation (with ion-assisted option); atomic layer deposition (ALD) for dielectrics and selected metals; and two e-beam metal evaporation tools

Characterisation facilities

Electrical: Two Cascade Summit series probe stations for on-wafer probing of device structures. One probe station is configured for RF measurements (Cascade Infinity Probes). Temperature range from -55 to 200 °C. Electrical test equipment includes: Agilent B1500 with integrated capacitance-voltage meter (x2), Agilent 4156 semiconductor parameter analyzer, Keithley 4200 semiconductor parameter analyzer, an Agilent 4284A (20Hz to 1 MHz) and 4294A (40Hz-110MHz, continuous frequency sweep) LCR meters, Agilent 81110A pulse/pattern generator. The equipment allows detailed analysis of MOS and MOSFET structures in a controlled environment from -55 to 200 °C. The continuous frequency sweep capability of the 4294A system is particularly suited to the conductance based analysis on interface defects in high-k/III-V or high-k/Ge systems. An Agilent E8361C PNA Network Analyzer, 10 MHz to 67 GHz is available for characterization of high frequency device performance. LakeShore HMS 8404 Hall Measurement System with the capabilities of DC (max 1.7 T) and AC (max 1.2 T) magnetic field, temperature range of 10 K to 400 K, resistance capability range from semi-metals (< 10-3 Ω) to high resistance (~1011 Ω), and Hall mobility range from ~10-3 cm2/V.s to ~106 cm2/V.s.


Carl Zeiss Supra 40 SEM + Oxford EDX+ HAADF STEM; FEI Quanta 650 SEM + Oxford EDX; Quanta 3D dual beam FIB; FEI Helios Nanolab 600i dual beam FIB+ Oxford EDX + HAADF STEM with Cryo SEM option for soft materials; JEOL TEM JEM 2100 + electron diffraction, SAED. In addition, Bruker AFM - Dimension Icon equipped with AFM Modes such as SSRM, SCM, PFTUNA, KPFM

People involved

Prof Paul Hurley (PI)


Dr Farzan Gity